ultra ats

The ultra ats Diamond knife is perfect for placing sections on Si wafers to view under the SEM. The knife comes in 3.0mm size with 35° angle. Please see the Technical Data Sheet for an illustration showing the technique of placing sections on a wafer.

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Version: *

New
Resharpen

Angle: *

35°

Edge Size: *

2.0mm
3.0mm
4.0mm

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Overview
Reviews

Knife type	Knife angle	Size [mm]	Thickness range [nm]	Boat type	Code (new knife)*	Application
ultra ats	35°	2.0mm	30-200	Boat	20-UL-ATS	Placing sections on Si wafers
ultra ats	35°	3.0mm	30-200	Boat	30-UL-ATS	Placing sections on Si wafers
ultra ats	35°	4.0mm	30-200	Boat	40-UL-ATS	Placing sections on Si wafers

The ultra ats Diamond Knife is perfect for placing sections on Si wafers to view under the SEM. The knife comes in 3.0mm size with 35° angle. Please see our Technical Data Sheet for an illustration showing the technique of placing sections on a wafer.

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Knife type	Knife angle	Size [mm]	Thickness range [nm]	Boat type	Code (new knife)*	Application
ultra ats	35°	2.0mm	30-200	Boat	20-UL-ATS	Placing sections on Si wafers
ultra ats	35°	3.0mm	30-200	Boat	30-UL-ATS	Placing sections on Si wafers
ultra ats	35°	4.0mm	30-200	Boat	40-UL-ATS	Placing sections on Si wafers

ultra ats

ultra 35°

Hand-Held Diamond Cleaver